The E-Beam Exposure Process - Overview
Background about how the ebeam system writes your patterns
This section has information about how the machine actually exposes a wafer. There are several key points that you will have to understand in order to design a properly working e-beam process and make intelligent selection of operating point among the many variables. Included in the descriptions here are:
What is an e-beam field, and how do I choose a Field Size?
What is a Machine Grid, and how does it depend on Field Size?
What is a Field Stitch, and how large are Field Stitching Errors?
How is e-beam Exposure Dose computed?
What is Shot Pitch, or Exposure Grid?