Resist Process Information
ma-N 2400 Series Negative Resist
maN-2400 series is a very-high contrast, high-speed negative e-beam resist.
We presently have small quantities of 3 different viscosities: maN-2410, maN-2403, & maN-2401. (NOTE! The names -2410 and -2401 look very similar, but are about 10X different in thickness. Look carefully, and double check before you spin!
Spin-Speed Curves
Suggested Process
1) Clean surface well.
2) For best adhesion, clean surface with piranha, or O2 plasma clean immediately prior to coating.
3) Spin
4) Post-apply Bake: 100 C Hotplate, 4 minutes.
5) Expose. Dose 200-400 uC/cm2
6) Develop. MF-319 developer, 30 seconds to 4 minutes (depending on thickness.)